Supply, Delivery and Installation of Hermetic Tender - 146282613

Procurement Summary

Country: United Kingdom

Summary: Supply, Delivery and Installation of Hermetic Sealing Kit

Deadline: 01 Sep 2026

Posting Date: 31 Jul 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 146282613

Document Ref. No.: JUL561290

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

CPV Classification

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Purchaser's Detail

Name: Login to see tender_details

Address: Login to see tender_details

Email: Login to see tender_detailsLogin to see details

Tender Details

Supply, Delivery and Installation of Hermetic Sealing Kit
BackgroundThe UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore.DescriptionThe University of Strathclyde has a requirement for an advanced Hermetic Sealing capability consisting of Seam Sealing and Projection Welding of hermetic packages used in photonic and advanced semiconductor packaging.
Reference number : UOS-43648-2026
Deadline : 2026-09-01

Documents

 Tender Notice