Supply, Delivery and Installation of Backgrind Tender - 146366845

Procurement Summary

Country: United Kingdom

Summary: Supply, Delivery and Installation of Backgrind Tape Laminator and De-Taping Kit

Deadline: 17 Aug 2026

Posting Date: 01 Aug 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 146366845

Document Ref. No.: JUL561392

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

CPV Classification

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Purchaser's Detail

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Tender Details

Supply, Delivery and Installation of Backgrind Tape Laminator and De-Taping Kit
BackgroundThe UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore.DescriptionAs part of this project NMIS requires an advanced backgrind tape laminator and de-taping turnkey platform to laminate and de-tape 6", 8" and 12" thin wafers that are required for photonics.
Reference number : UOS-43492-2025
Deadline : 2026-08-17

Documents

 Tender Notice