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UNIVERSITY COLLEGE CORK has floated a tender for Supply, Delivery and Commissioning of a High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, Ucc. The project location is Ireland and the tender is closing on 25 Jun 2024. The tender notice number is 3644242, while the TOT Ref Number is 101591215. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.
Procurement Summary
Country : Ireland
Summary : Supply, Delivery and Commissioning of a High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, Ucc
Deadline : 25 Jun 2024
Other Information
Notice Type : Tender
TOT Ref.No.: 101591215
Document Ref. No. : 3644242
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : Refer Document
Purchaser's Detail
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Login to see detailsTender Details
Tenders are sought for the supply and delivery of High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC. Miniaturisation and integration are key themes across all areas of Tyndall-s research. Development of next generation technologies requires ever decreasing device sizes coupled with ever-increasing functionality. The task of miniaturisation beings with device design and fabrication where sub-micron technologies are now industry standard, and the development of nanoscale processes is progressing rapidly. The challenges of miniaturisation extend onwards to the back-end processes where the removal of unused bulk semiconductor material through precision lapping and polishing is essential to minimising the size of a final device. Tyndall now wishes to enhance its back-end processing capability through the procurement of a high-precision wafer lapping and polishing system for use with silicon, III-V and other semiconductor materials.
Procedure : Open
Publication Date : 25/06/2024
Deadline : 25/06/2024 14:00:00
Documents
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