Procurement Summary
Country: Spain
Summary: Supply Contract of Equipment for Laser Machining of Radio Frequency Substrates, Within the Framework of the Recovery, Transformation and Resilience Plan - Financed by the European Union - N...
Deadline: 17 Jun 2026
Posting Date: 15 May 2026
Other Information
Notice Type: Tender
TOT Ref.No.: 141343320
Document Ref. No.: 331307-2026
Competition: ICB
Financier: Self Financed
Purchaser Ownership: Public
Tender Value: EUR 500000
CPV Classification
42900000 - Miscellaneous general and special-purpose machinery
Purchaser's Detail
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Tender Details
SUPPLY CONTRACT OF EQUIPMENT FOR LASER MACHINING OF RADIO FREQUENCY SUBSTRATES, WITHIN THE FRAMEWORK OF THE RECOVERY, TRANSFORMATION AND RESILIENCE PLAN - FINANCED BY THE EUROPEAN UNION - N... SUPPLY CONTRACT OF EQUIPMENT FOR MACHINING SUBSTRATE LASER FOR RADIO FREQUENCY, WITHIN THE FRAMEWORK OF THE RECOVERY, TRANSFORMATION AND RESILIENCE PLAN - FINANCED BY THE EUROPEAN UNION - NEXT GENERATION EU THROUGH THE UNIQUE CHIPS JU PROGRAM - INTEGRATED PHOTONICS PILOT LINE, AND THE PROGRAMS EUROPE HORIZON AND DIGITAL EUROPE SUPPLY OF EQUIPMENT FOR LASER MACHINING OF RADIO FREQUENCY SUBSTRATES The purpose of this contract is the acquisition of laser machining equipment for radiofrequency substrates, including accessories or auxiliary devices that are necessary for the operability of the photonics pilot line established by PIXEurope. The acquisition and operation of the Chips JU pilot line are jointly financed by Chips JU and the States participants: Austria, Belgium, Finland, France, Ireland, Netherlands, Portugal and Spain. The Chips Joint Undertaking and IMDEA Networks have signed a Joint Procurement Agreement for PIXEurope project equipment. Specifically, the acquisition and The operation of this equipment is co-financed by Spain through the Ministry of Digital Transformation and Public Function with the reference CJU-010000-2025-0008, as part of the Recovery, Transformation and Resilience Plan (PRTR). The object of This document is to define the technical and functional characteristics necessary for the acquisition of equipment for laser machining of substrate...
Document Type: Contract Notice Reference Number: L07-2026 Contract Type: supplies Estimated Value: 500000 - EUR Authority Type: body-pl-ra Doc Title: SUPPLY CONTRACT OF EQUIPMENT FOR LASER MACHINING OF SUSTRATES FOR RADIO FREQUENCY, IN THE FRAMEWORK OF THE RECOVERY, TRANSFORMATION AND RESILIENCE PLAN – FINANCED BY THE EUROPEAN UNION - NEXT GENERATION EU THROUGH THE UNIQUE CHIPS JU PROGRAM – INTEGRATED PHOTONICS PILOT LINE, AND THE HORIZON EUROPE AND DIGITAL EUROPE PROGRAMS Dispatch Date: 2026-05-13 Publish Date: 2026-05-15 Submission Date: 2026-06-17
Documents
Tender Notice