Supply and Installation of a Multipurpose Chip Tender - 138322541

Procurement Summary

Country: Spain

Summary: Supply and Installation of a Multipurpose Chip Bonding System and Advanced Materials Dispenser. Funded by the European Union - Nextgenerationeu through the Recovery and Resilience Mechanism...

Deadline: 08 Apr 2026

Posting Date: 24 Mar 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 138322541

Document Ref. No.: 34889/26

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: EUR 170000.00

CPV Classification

31712000 - Microelectronic machinery and apparatus and microsystems
31712110 - Electronic integrated circuits and microassemblies
31712116 - Microprocessors

Purchaser's Detail

Name: Login to see tender_details

Address: Login to see tender_details

Email: Login to see tender_detailsLogin to see details

Tender Details

Supply and Installation of a Multipurpose Chip Bonding System and Advanced Materials Dispenser. Funded by the European Union - Nextgenerationeu for the Recovery and Resilience Mechanism. Scientific Project Code: (Micronanofabs_Phase 2)-Icts-Mrr-2024-04-Csic Destined for the Institute of Microelectronics of Barcelona (Imb-Cnm)
Contract Type: Supplies CPV code: 31712000-Microelectronic machinery, devices and microsystems., 31712110-Integrated circuits and electronic microstructures., 31712116-Microprocessors. Contracting Authority ID: 61707810214541 Financing EU: Associated with the Recovery, Transformation and Resilience Plan Place of Execution: Spain - Barcelona - Bellaterra (Cerdanyola del Vallès) BARCELONA

Documents

 Tender Notice