Procurement Summary
Country: France
Summary: Supply of 12Μm Ultrasonic Wire Cabling Machine
Deadline: 14 Sep 2026
Posting Date: 31 Jul 2026
Other Information
Notice Type: Tender
TOT Ref.No.: 146290256
Document Ref. No.: B26-02914-EJ
Competition: ICB
Financier: Self Financed
Purchaser Ownership: Public
Tender Value: Refer Document
CPV Classification
31640000 - Machines and apparatus with individual functions
Purchaser's Detail
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Login to see detailsTender Details
Supply of 12µm ultrasonic wire cabling machine
Published on: 2026-07-30 00:00:00 Deadline date and time for submission of envelopes: 2026-09-14 Subject: The LAIP, Component Assembly and Integration Laboratory for Photonics, is carrying out wire cabling steps for its packaging activities. functional devices. The current evolution of performances and the miniaturization of pad sizes on chips leads us to supply a new wire wiring machine allowing ultrasonic welding with wires of 12μm versus 25μm current market standard This document defines our needs for the acquisition of a new machine. Overall, it must allow cabling at least in 12μm but also in 25 and 75μm, from chips to boxes or the interconnection of chips directly on a 200mm plate. The equipment must also allow semi-automatic wiring of wires of dimensions Public entity: Other organizations CPV code: 31640000 Purchasing Entity: AO / CEA / CEA / GRENOBLE - CENTER OF GRENOBLE Announcement type: Consultation announcement Main category: Supplies
Documents
Tender Notice