Sources Sought a Close Fixture for Suss Wafer Tender - 144115099

Procurement Summary

Country: USA

Summary: Sources Sought Notice for a Close Fixture for Suss Wafer Bonder

Deadline: 07 Jul 2026

Posting Date: 27 Jun 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 144115099

Document Ref. No.: NIST-SS26-10

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

Purchaser's Detail

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Tender Details

NIST-SS26-10
6640 / 334516
Primary POC: Liz Timberlake ([email protected])
Title: Close Fixture for Suss Wafer Bonder
BACKGROUND
***THIS IS A SOURCES SOUGHT NOTICE***
National Institute of Standards and Technology (NIST) seeks to acquire a universal SiC closed fixture for SUSS Gen2 Wafer Bonder. The SUSS wafer bonder provides a unique function of enabling atomic bonding of two substrates by applying high pressure, high heat or high electric current. This specialty tool currently is not able to support most of bonding processes due to the breakage of its original universal SiC closed fixture. It is essential to replace this fixture in order to enable all functions and support various sizes of samples. Wafer bonding has become a popular and important process among photonic device innovation, semiconductor packaging, quantum device research and new material development.
NIST has a need for a universal SiC closed fixture that meets or exceeds the following draft minimum specifications:
The Contractor shall provide one (1) universal SiC closed fixture that meet the following minimum specifications:
All material shall be new; rebuilt system components will not be considered.
This fixture shall be able to transfer and support bonding process for substrates in various shapes and sizes ranged from 10 mm to at least 150 mm.
This fixture shall come with proper bonding plates for the following types of bonds: thermocompression, eutectic, adhesion, anodic and fusion bonds.
The plate at the center of universal closed fixture shall be made of SiC with the flatness level compatible with Suss wafer bonder operation and is able to resist 20 kN force applied by Suss wafer bonder.
The fixture shall include three clamping arms to secure the positions of 100 mm wafer stack.
The entire fixture, including clamping arms, shall be able to withstand processing temperature up to 550 ◦C, and chamber overpressure at least 2 bar ...
Notice ID: nist-ss26-10

Department/Ind. Agency: commerce, department of

Sub-tier: national institute of standards and technology

Office: dept of commerce nist

Product Service Code: 6640 - laboratory equipment and supplies

NAICS Code: 334516 - Analytical Laboratory Instrument Manufacturing

Inactive Dates: jul 22, 2026

Inactive Policy: 15 days after response date

Documents

 Tender Notice