Procurement Summary
Country: Austria
Summary: Silicon Austria Labs - Chips Ju: Plasma Activation System for D2W Bonding
Deadline: 31 Mar 2026
Posting Date: 24 Mar 2026
Other Information
Notice Type: Tender
TOT Ref.No.: 138346165
Document Ref. No.: 201554-2026
Competition: ICB
Financier: Self Financed
Purchaser Ownership: Public
Tender Value: EUR 650000.00
CPV Classification
38000000 - Laboratory, optical and precision equipments (excl. glasses)
Purchaser's Detail
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Login to see detailsTender Details
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a wafer-level plasma activation system for wafer bonding application for Silicon Austria Labs GmbH. Silicon Austria Labs - Chips JU: Plasma Activation system for D2W bonding Doc Title: Silicon Austria Labs - Chips JU: Plasma Activation system for D2W bonding Contract Type: supplies
Document Type: Contract Notice Reference Number: 1 Contract Type: supplies Estimated Value: 650000.00 - EUR Authority Type: pub-undert-cga Doc Title: Silicon Austria Labs – Chips JU: Plasma Activation system for D2W bonding Dispatch Date: 2026-03-23 Publish Date: 2026-03-24 Submission Date: 2026-03-31
Documents
Tender Notice