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The DEPT OF DEFENSE | DEPT OF THE ARMY has issued a Tender notice for the procurement of a Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies in the USA. This Tender notice was published on 18 Aug 2026 and is scheduled to close on 16 Sep 2026, with an estimated Tender value of Refer Document. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 147422159, while the tender notice number is W52P1J26R0001 and Registering on the platform.
Procurement Summary
Country: USA
Summary: Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies
Deadline: 16 Sep 2026
Posting Date: 18 Aug 2026
Other Information
Notice Type: Tender
TOT Ref.No.: 147422159
Document Ref. No.: W52P1J26R0001
Competition: ICB
Financier: Self Financed
Purchaser Ownership: Public
Tender Value: Refer Document
CPV Classification
31712300 - Printed circuitsPurchaser's Detail
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Login to see detailsTender Details
Refer to the Attachment, R2.0_SS_RFI_SUBMISSION_v1.2.
Notice ID: w52p1j26r0001
Department/Ind. Agency: dept of defense
Sub-tier: dept of the army
Product Service Code: r425 - support- professional: engineering/technical
NAICS Code: 541715 - Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
Inactive Dates: oct 01, 2026
Inactive Policy: 15 days after response date
Disclaimer: The deadline date mentioned is tentative and provided for informational purposes only. This notice is a procurement forecast or general procurement plan, and not an active tender. Suppliers are advised to refer to the original documents and contact the issuing authority directly for the official tender release date and further details
Documents
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Refer Document
Procurement Documents for USA
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