Procurement Summary
Country : Japan
Summary : Room Temperature Wafer Bonding Machine 1 Set
Deadline : 26 Feb 2025
Other Information
Notice Type : Tender
TOT Ref.No.: 112716889
Document Ref. No. :
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : Refer Document
Purchaser's Detail
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Login to see detailsTender Details
Room temperature wafer bonding machine 1 Set
Classification :
0016 Electrical Machinery/Apparatus & Appliances/& Electrical Parts Thereof
Summay of Notice :
⑴ Official in charge of disbursement of the procuring entity : ISHIBASHI Tatsuro, President of Kyushu University
⑵ Classification of the products to be procured : 16
⑶ Nature and quantity of the products to be purchased : Room temperature wafer bonding machine 1 Set
⑷ Delivery period : By 30 September, 2025
⑸ Delivery place : The place specified by President of Kyushu University
⑹ Qualifications for participating in the tendering procedures : Suppliers eligible for participating in the proposed tender are those who shall :
A not come under Article 5 and 6 of the Regulation concerning the Contract for Kyushu University Furthermore, minors, Person under Conservatorship or Person under Assistance that obtained the consent necessary for concluding a contract may be applicable under cases of special reasons within the said clause,
B have the Grade A, Grade B, Grade C or Grade D qualification during fiscal 2024 in the Kyushu・Okinawa area in sales of product for participating in tenders by Single qualification for every ministry and agency, or in tenders by The Corporation of National Universities Kyushu University,
C prove to have prepared a system to provide rapid after-sales service and maintenance for the procured products,
D prove to have the ability to deliver the products, required ...
Documents
Tender Notice