Request for Information for Silicongermanium Tender - 138531800

Procurement Summary

Country: USA

Summary: Request for Information for Silicongermanium Epitaxial Wafers

Deadline: 03 Apr 2026

Posting Date: 27 Mar 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 138531800

Document Ref. No.: NB305000-26-00183

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

Purchaser's Detail

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Tender Details

This is a notice to request information from industry to help the U.S. Department of Commerce, National Institute of Standards and Technology (NIST) determine the availability and capability of businesses to provide Silicon/Germanium Epitaxial Wafers and the ability to quote at a firm fixed price.
This notice is strictly to request information for market research purposes to help NIST determine the appropriate acquisition strategy for this requirement. This notice shall not be construed as a solicitation, an obligation, or commitment by NIST.
The NIST CHIPS Metrology program develops and advances cutting edge metrology capabilities for members of the US semiconductor manufacturing ecosystem. This NIST conducted research program works with device manufacturers, tool vendors, materials suppliers, and other organizations to address critical metrology gaps to spur innovation within seven grand challenge areas.
Silicon wafers with epitaxial layer of silicon and silicon/germanium are an essential item for modern semiconductor manufacturing. Some manufacturers perform epitaxial growths in house while other film stacks can be purchased. Wafer with specific compositions, thicknesses, and dopant levels, and supporting measurements are available at various wafer sizes and lot sizes.
CHIPS Metrology researchers at NIST require high-quality epitaxial film stacks on silicon wafers. Although we anticipate changes in the exact specifications of each wafer lot purchased, the general classes of wafer products can be well described.
The anticipated contract includes base line items with full wafer specifications. Additionally, there are optional line items where the exact specifications for lot size, layer count, thicknesses, and layer composition/doping will be specified upon ordering. These slight variations in the wafers would include changes to and including:
Wafer composition- “Thin” doped Si on Si, “Thick” doped Si on Si, Isotopically enriched 28Si on Si, “...
Notice ID: nb305000-26-00183

Department/Ind. Agency: commerce, department of

Sub-tier: national institute of standards and technology

Office: dept of commerce nist

NAICS Code: 334413 - Semiconductor and Related Device Manufacturing

Inactive Dates: apr 18, 2026

Inactive Policy: 15 days after response date

Documents

 Tender Notice

Documents.zip