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Rapid Thermal Annealing System Tender in USA - 139364426

The COMMERCE, DEPARTMENT OF | NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY has issued a Tender notice for the procurement of a Rapid Thermal Annealing System in the USA. This Tender notice was published on 11 Apr 2026 and is scheduled to close on 24 Apr 2026, with an estimated Tender value of Refer Document. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 139364426, while the tender notice number is NIST-SS26-105 and Registering on the platform.

Expired Tender

Procurement Summary

Country: USA

Summary: Rapid Thermal Annealing System

Deadline: 24 Apr 2026

Posting Date: 11 Apr 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 139364426

Document Ref. No.: NIST-SS26-105

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

Purchaser's Detail

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Tender Details

Notice ID Number: NIST-SS26-105
Title: Sources Sought Notice for Rapid Thermal Annealing System
The purpose of this sources sought notice is to conduct market research and identify potential sources of commercial products/services that satisfy the Government-s anticipated needs.
BACKGROUND
The Boulder Microfabrication Facility (BMF) is an ISO class 5 cleanroom that micro- and nano- fabricates devices to meet the NIST mission. Part of the required processing includes rapidly annealing films. This is achieved though using a Rapid Thermal Annealing (RTA) system. The BMF currently has an RTA system used to process 76.2 mm substrates, and the BMF currently requires the ability to process up to 150 mm substrates.
The minimum specifications for the RTA system are:
Must be able to perform RTA according to semiconductor industry standards.
Must meet all applicable safety and cleanliness standards for use in an ISO class 5 cleanroom.
Must be able to reach temperatures of room temperature to 1200 °C with a temperature stability of +/- 1 °C
Must have a ramp rate of at least 100 °C/s
Must be able to anneal substrates in a vacuum and in gas environments.
Must be able to deliver at least 4 gasses including but not limited to 5 % H2 in Ar, Ar, Pure dry air (80 % N2 / 20 % O2), and nitrogen with digital mass flow controllers.
Must be able to fit in a 1 m x 1 m x 2 m (W X D X H) floor space.
Must be able to process substrates from chips to 150 mm SEMI spec wafers.
Must be able to load samples with a clamshell or tray loading system with a preference for a clamshell system.
Prototypes, one-off systems, demonstration models, used instruments, or refurbished instruments will not be considered for award.
HOW TO RESPOND TO THIS NOTICE
In responding to this notice, please DO NOT PROVIDE PROPRIETARY INFORMATION. Please include only the following information, readable in either Microsoft Word 365, Microsoft Excel 365, or .pdf forma...
Notice ID: nist-ss26-105

Department/Ind. Agency: commerce, department of

Sub-tier: national institute of standards and technology

Office: dept of commerce nist

Inactive Dates: may 09, 2026

Inactive Policy: 15 days after response date

Documents

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