Public Tender Announcement of the Wafer Bonding Tender - 124823321

The XI'AN UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY has issued a Tender notice for the procurement of a Public Tender Announcement of the Wafer Bonding Machine Procurement Project of Xi'an University of Electronic Science and Technology in the China. This Tender notice was published on 21 Aug 2025 and is scheduled to close on 27 Aug 2025, with an estimated Tender value of Refer Document. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 124823321, while the tender notice number is 0617-2521HZ1866(XDH25032D) and Registering on the platform.