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Procurement of Wafer-Level Chiplet Heterogeneous Tender - 147828554

The HEBEI SEMICONDUCTOR RESEARCH INSTITUTE has issued a Tender notice for the procurement of a Procurement of Wafer-Level Chiplet Heterogeneous Integration Systems by the 13Th Research Institute of China Electronics Technology Group Corporation in the China. This Tender notice was published on 24 Aug 2026 and is scheduled to close on 18 Sep 2026, with an estimated Tender value of Refer Document. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 147828554, while the tender notice number is 0722-264JT3342ZB6 and Registering on the platform.

Procurement Summary

Country: China

Summary: Procurement of Wafer-Level Chiplet Heterogeneous Integration Systems by the 13Th Research Institute of China Electronics Technology Group Corporation

Deadline: 18 Sep 2026

Posting Date: 24 Aug 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 147828554

Document Ref. No.: 0722-264JT3342ZB6

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

CPV Classification

31712118 - Integrated circuit sockets or mounts
31712114 - Integrated electronic circuits
31712353 - Metal oxide field effect transistors (MOSFET)
31712110 - Electronic integrated circuits and microassemblies
31712117 - Integrated circuit packages

Purchaser's Detail

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Tender Details

Procurement Of Wafer-Level Chiplet Heterogeneous Integration Systems By The 13Th Research Institute Of China Electronics Technology Group Corporation
Place of Implementation: Shijiazhuang City, Hebei Province, China
Deadline: 2026-09-18

Documents

Tender Notice

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