Procurement of Laptop for Replication of Forms or Reports for the School Based Feeding... Tender

DEPARTMENT OF EDUCATION - ISABELA has floated a tender for Procurement of Laptop for Replication of Forms or Reports for the School Based Feeding Program. The project location is Philippines and the tender is closing on 01 Sep 2025. The tender notice number is 60-2025-08-322, while the TOT Ref Number is 125365224. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.

Expired Tender

Procurement Summary

Country: Philippines

Summary: Procurement of Laptop for Replication of Forms or Reports for the School Based Feeding Program

Deadline: 01 Sep 2025

Other Information

Notice Type: Tender

TOT Ref.No.: 125365224

Document Ref. No.: 60-2025-08-322

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: PHP 99900.00

Purchaser's Detail

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Tender Details

Tender are invited for PROCUREMENT OF LAPTOP FOR REPLICATION OF FORMS OR REPORTS FOR THE SCHOOL BASED FEEDING PROGRAM

Procurement Mode : Negotiated Procurement - Small Value Procurement (Sec. 53.9)

Classification : Goods

Category : Office Supplies and Devices

Contract Duration : 10 Day/s

Budget for the Contract : PHP 99, 900.00

Area of Delivery : Isabela

Description : 1 Laptop 2 pcs 99, 900.00

CPU

Mark score of 17, 946 or higher* based on CPU benchmarking at https://www.cpubenchmark.net/laptop.html High Performance, Slim (lower power) Processor

6 cores 12 threads

Base Clock 3.3GHz - Boost Clock to 4.55GHz

L1 Cache 64 KB L2 Cache 512 KB L3 Cache 16 MB

Pcle 4.0, 20 Lanes(CPU Only)

DDR5 6400MT/s

GPU

Clock Speeds

Base Clock: 735 MHz

Boost Clock: 1245 MHz

Memory Clock: 1750 MHz, 14 Gbps effective

Memory

Memory Size: 4 GB

Memory Type: GDDR6

Memory Bus: 64 bit

Bandwidth: 112.0 GB/s

Graphic Features

Directx: 12 Ultimate (12_2)

OpenGL: 4.6

OpenCL: 3.0

Vulkan: 1.3

CUDA: 8.6

Shader Model: 6.8

Chipset

Type: BGA (Ball Grid Array)

Architecture: Zen 3+ (Rembrandt) and Zen 4

Process Size: 6nm (For Zen 3+ and Zen 4)

Die Size: 178mm² (Zen 4)

Package: FP7 and FP7r2

Memory Support: DDR5 and LPDDR5 (up to 6400 MT/s

PCle: Pcle 4.0

TDP: Configurable, typically ranging from 15W to 54W

Max Operating Temperatu...

Documents

 Tender Notice


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