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The TECHNOLOGY RESEARCH CENTER VTT OY has issued a Tender notice for the procurement of a Plasma Enhanced Chemical Vapour Deposition Tool in the Finland. This Tender notice was published on 12 May 2026 and is scheduled to close on 14 May 2026, with an estimated Tender value of Refer Document. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 141081296, while the tender notice number is 613227 and Registering on the platform.
Procurement Summary
Country: Finland
Summary: Plasma Enhanced Chemical Vapour Deposition Tool
Deadline: 14 May 2026
Posting Date: 12 May 2026
Other Information
Notice Type: Tender
TOT Ref.No.: 141081296
Document Ref. No.: 613227
Competition: ICB
Financier: Self Financed
Purchaser Ownership: Public
Tender Value: Refer Document
Purchaser's Detail
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Email: Login to see tender_detailsLogin to see details Tender Details THE SUBJECT OF THE PROCUREMENTThe subject of the procurement is a plasma-enhanced automated cassette to cassette chemical vapor deposition (PECVD) system for deposition of dielectric thin films (SiO₂, SiN, TEOS, SiON, a Si) for research and pilot line use in the VTT Micronova cleanroom.DIRECT AWARD, Article 40 2(2) of Finnish Procurement act (1397/2016)The procurement will be carried out as a direct award in accordance with 40 article Section 2(2) of the Finnish Public Procurement Act. According to the 40 § section 2(2) of the Act on Public Contracts (1397/2016), only a certain supplier can implement the procurement for a technical reason, or for a reason related to protecting an exclusive right; it shall be a further condition that there are no reasonable alternatives or substitute solutions, and that the absence of competition is not due to an artificial narrowing of the terms and conditions of the procurement. The justification for direct procurement applies in this case, as VTT already operates an existing deep reactive ion etching (DRIE) system manufactured by SPTS. In order to extend the operational lifetime of the existing etch chamber, and optimize the use of limited cleanroom space, it is necessary to integrate the existing etch chamber with a new system.Due to proprietary hardware and software rights, only the original manufacturer of the existing DRIE system (KLA/SPTS) is technically capable of integrating the etch chamber with newer system configurations. The proc... Documents
Published: 11/05/2026
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