Home » Tenders » Americas » USA » Tender 63811476

Packaging of On-Chip Integrated Silicon Carbide Tender - 63811476

The NATIONAL AERONAUTICS AND SPACE ADMINISTRATION has issued a Tender notice for the procurement of a Packaging of On-Chip Integrated Silicon Carbide Pressure and Micro-Tc Sensors in the USA. This Tender notice was published on 28 Feb 2022 and is scheduled to close on 02 Mar 2022, with an estimated Tender value of Refer Document. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 63811476, while the tender notice number is 80NSSC794425Q and Registering on the platform.

Procurement Summary

Country: USA

Summary: Packaging of On-Chip Integrated Silicon Carbide Pressure and Micro-Tc Sensors

Deadline: 02 Mar 2022

Posting Date: 28 Feb 2022

Other Information

Notice Type: Tender

TOT Ref.No.: 63811476

Document Ref. No.: 80NSSC794425Q

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

Purchaser's Detail

Name: Login to see tender_details

Address: Login to see tender_details

Email: Login to see tender_details

Tender Details

Packaging of on-chip integrated silicon carbide pressure and micro-TC sensors
Active Contract Opportunity
Notice ID : 80NSSC794425Q
Related Notice
Department/Ind. Agency : NATIONAL AERONAUTICS AND SPACE ADMINISTRATION : :
General Information
Contract Opportunity Type: Special Notice (Original)
All Dates/Times are: (UTC-06:00) CENTRAL STANDARD TIME, CHICAGO, USA
Original Published Date: Feb 25, 2022 03:20 pm CST
Original Response Date: Mar 02, 2022 04:00 pm CST
Inactive Policy: 15 days after response date
Original Inactive Date:
Initiative: None
Classification
Original Set Aside:
Product Service Code: 9390 - MISCELLANEOUS FABRICATED NONMETALLIC MATERIALS
NAICS Code: 541715 - Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
Place of Performance: Cleveland, OH 44135 USA
Description
NASA/NSSC has a requirement for Packaging of on-chip integrated silicon carbide pressure and micro-TC sensors.
NASA/NSSC intends to issue a sole source contract to Sienna Technologies, Inc., 19501 144th Avenue NE, Suite F-500 Woodinville, WA 98072-4423, under the authority of FAR 13.106-1(b)(1)(i). It has been determined that Sienna Technologies, Inc. is the sole provider of the Packaging of on-chip integrated silicon carbide pressure and micro-TC sensors.
NASA/NSSC will be the procuring center for this effort. Performance will be located a...

Documents

Tender Notice

Browse More

All Tenders From USA

All Tenders From Americas

Procurement Documents for USA

Access a comprehensive library of standard procurement documents specific to USA. Here, you'll find all the essential forms, guidelines, and templates required for tender applications and submissions in USA

Explore Procurement Documents for USA

Want To Bid in This Tender?

Get Local Agent Support in USA and 60 More Countries.

View All The Services

View Tenders By