Notice of Intent to Sole Source for Silicon Wafers with Multiple Thin Films Tender

Procurement Summary

Country : USA

Summary : Notice of Intent to Sole Source for Silicon Wafers with Multiple Thin Films

Deadline : 28 May 2025

Other Information

Notice Type : Tender

TOT Ref.No.: 119167692

Document Ref. No. :

Financier : Self Financed

Purchaser Ownership : Public

Tender Value : Refer Document

Purchaser's Detail

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Tender Details

Description

Notice of Intent to Noncompetitively acquire Semiconductor Wafers with Multiple Thin Films.

This notice is not a request for a quotation. A solicitation document will not be issued, and quotations will not be requested.

This acquisition is being conducted under the authority of FAR 13.106-1(b). The North American Industry Classification System (NAICS) code for this acquisition is 334413, Semiconductor and Related Device Manufacturing which has a small business size standard of 1, 250 employees.The semiconductor supply chain is global, specialized, and interconnected. Chipmakers do business with thousands of individual suppliers that provide the highly complex materials and tools used to produce semiconductors. To address the lack of full visibility into the semiconductors markets supply chain and R&D ecosystem gaps the National Institute of Standards and Technology (NIST) will conduct the measurement science, or metrology, critical to the development of new materials, packaging, and production methods in chip manufacturing.

With this goal, the NIST Biomedical Measurement Technologies Group within the Microsystems and Nanotechnology Division of the Physical Measurement Laboratory (PML) requires specialized test substrates composed of silicon wafers enhanced with multiple thin films. These substrates are a critical component of a CHIPS program to assess the functionalization of semiconductor substrates with passivation and biorecognition elements to advance measurements of manufacturable CMOS biosensors.

This project aims to rigorously assess the stability and reliability of biomolecule attachment to semiconductor surfaces, which is vital for the development of effective biosensors. The substrates required will serve as an industry reference point for NIST's internal samples. As such, they must be manufactured on high-quality foundry or research-grade semiconductor fabrication lines capable of processing 200 mm silicon wafers. The thin ...
Active Contract Opportunity
Notice ID :
Related Notice : NIST-SS25-CHIPS-0049
Department/Ind. Agency : COMMERCE, DEPARTMENT OF
Sub-tier : NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY
Office: DEPT OF COMMERCE NIST
General Information
Contract Opportunity Type: Special Notice (Updated)
Updated Published Date: May 14, 2025 01:37 pm EDT
Original Published Date: May 14, 2025 09:43 am EDT
Updated Response Date: May 28, 2025 10:00 am EDT
Original Response Date: May 28, 2025 10:00 am EDT
Inactive Policy: 15 days after response date
Updated Inactive Date: Jun 12, 2025
Original Inactive Date: Jun 12, 2025
Initiative: None

Classification
Original Set Aside:

Product Service Code: 5961 - SEMICONDUCTOR DEVICES AND ASSOCIATED HARDWARE
NAICS Code: 334413 - Semiconductor and Related Device Manufacturing

Place of Performance: Gaithersburg, MD 20899 USA

Documents

 Tender Notice