National Science Foundation - Future of Semiconductors Tender, USA - 77785760

Procurement Summary

Country : USA

Summary : National Science Foundation - Future of Semiconductors

Deadline : 24 Apr 2023

Other Information

Notice Type : Tender

TOT Ref.No.: 77785760

Document Ref. No. : 23-552

Financier : Self Financed

Purchaser Ownership : Public

Tender Value : USD 40000000

Purchaser's Detail

Name :Login to see tender_details

Address : Login to see tender_details

Email : Login to see tender_details

Login to see details

Tender Details

Tender are invited for National Science Foundation - Future of Semiconductors
CFDA Number : 47.041 -- Engineering47.049 -- Mathematical and Physical Sciences47.070 -- Computer and Information Science and Engineering47.076 -- STEM Education (formerly Education and Human Resources)47.084 -- NSF Technology, Innovation, and Partnerships
Cost Sharing or Matching Requirement : No
Estimated Total Program Funding : $40, 000, 000
Closing Date for Applications: Apr 24, 2023
Posted Date : Jan 25, 2023
Description: The current state of semiconductor microelectronic systems is at a crossroads. Continued advances in the capabilities of many technologies as well as the cost of the applications of these technologies across computing, sensing, and communications are threatened. The technology has expanded following the trends in miniaturization long characterized by Moore’s Law, underpinned by new materials, processes, devices, and architectures. The developments in these underpinning areas have often progressed independent of the application area, which has delayed their incorporation into the next-generation technologies. Closing that gap between the essential components in the technology chain is now required to ensure further progress. The materials, devices, and systems need to be co-designed, that is, they need to be designed with simultaneous consideration of elements of the technology chain.The benefits of a co-design approach as a principal methodology to advance semiconductor technology have been widely recognized in a variety of government and industry studies. This holistic, co-design approach can more rapidly create high-performance, robust, secure, compact, energy-efficient, and cost-effective solutions. The technological drivers include the need to: dramatically reduce the energy consumption of computation and communication technologies; reduce the impact of device and system manufacturing on the environment; increase performance speed and capacity; and develop new computing systems.The g...

Documents

 Tender Notice

RFI-367-23-00002-Full-Announcement--Request-For-Information.zip

Request-for-Information--USAID-Integrated-Nutrition.pdf