National Infrastructure for Encapsulation Tender - 138691667

Procurement Summary

Country: Greece

Summary: National Infrastructure for Encapsulation of Nano/Microelectronic Devices and Circuits (Nanopack)

Deadline: 28 Apr 2026

Posting Date: 30 Mar 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 138691667

Document Ref. No.: 217174-2026

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: EUR 330645

CPV Classification

31712100 - Microelectronic machinery and apparatus

Purchaser's Detail

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Tender Details

The object of the contract is the supply of a national infrastructure for encapsulation of nano/microelectronic devices and circuits (NANOPACK). In more detail, this procurement concerns one (1) system to meet micro/nano packaging needs electronic devices and integrated circuits, which will include: 1.one (1) table top welding system for cables and mechanical testers 2.one (1) semi-automatic micro-assembly system for welding and component placement applications. OR supply includes the obligation of the supplier to guarantee its operation for at least the period of time mentioned in the specifications of each type (see APPENDIX I - tables of technical specifications and requirements). It also includes and the obligation of the supplier to place and install the equipment, to train the competent staff of IHDL in matters of basic operation and maintenance of the equipment as well as in matters of safety and to deliver it in full operation after a technical check of good operation. In addition, it also includes the supplier's obligation to guarantee the availability of spare parts for at least seven (7) years. Doc Title: National Infrastructure for Encapsulation of Nano/Microelectronic Devices and Circuits (NANOPACK) Contract Type: supplies
Document Type: Contract Notice Reference Number: National infrastructure for encapsulation of nano/microelectronic devices and circuits (NANOPACK) Contract Type: supplies Estimated Value: 330645 - EUR Authority Type: org-sub-cga Doc Title: National boxing infrastructure nano/microelectronic devices and circuits (NANOPACK) Dispatch Date: 2026-03-27 Publish Date: 2026-03-30 Submission Date: 2026-04-28

Documents

 Tender Notice