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Nantong Kangyuan Integrated Circuit Packaging Tender - 140085021

The NANTONG HONG YUEN CIRCUIT TECHNOLOGY CO., LTD. has issued a Tender notice for the procurement of a Nantong Kangyuan Integrated Circuit Packaging Substrate Project (Phase I)- Vertical Continuous Panel Plating Line 1Set in the China. This Tender notice was published on 24 Apr 2026 and is scheduled to close on 15 May 2026, with an estimated Tender value of Refer Document. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 140085021 and Registering on the platform.

Procurement Summary

Country: China

Summary: Nantong Kangyuan Integrated Circuit Packaging Substrate Project (Phase I)- Vertical Continuous Panel Plating Line 1Set

Deadline: 15 May 2026

Posting Date: 24 Apr 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 140085021

Document Ref. No.: Login to see details

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

Purchaser's Detail

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Documents

Tender Notice

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