Login
Login
Register
Complete Your Profile
Change Password
Request a Password Reset
Download Documents
Download Documents
Get Help to Participate in This Tender
Change Password
For better security, update the account password.
The DEPT OF DEFENSE | DEFENSE MICROELECTRONICS ACTIVITY (DMEA) has issued a Tender notice for the procurement of a Multiple Award PCB Fab and Assembly BPAs 20262030 in the USA. This Tender notice was published on 02 Dec 2025 and is scheduled to close on 15 Dec 2025, with an estimated Tender value of Refer Document. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 131299146, while the tender notice number is HQ072725QRT04 and Registering on the platform.
Procurement Summary
Country: USA
Summary: Multiple Award PCB Fab and Assembly BPAs 20262030
Deadline: 15 Dec 2025
Posting Date: 02 Dec 2025
Other Information
Notice Type: Tender
TOT Ref.No.: 131299146
Document Ref. No.: HQ072725QRT04
Financier: Self Financed
Purchaser Ownership: Public
Tender Value: Refer Document
Purchaser's Detail
Name: Login to see tender_details
Address: Login to see tender_details
Email: Login to see tender_details
Login to see detailsTender Details
Re-solicitation of HQ072725QRT04
DMEA's mission includes developing electronics solutions that solve DOD obsolescence issues and/or provides state of the art SatCom solutions to DOD Programs. As such, there is a need to (1) rapidly produce developmental Printed Circuit Board Assemblies (PCBAs) for initial design and development use, (2) quickly produce prototype PCBAs for design validation, and (3) manufacture high quality PCBAs for use in DOD operational environments.
DMEA intends to competitively issue six BPA agreements to offerors based on three factors in the Proposal Instructions and Evaluation Criteria. DMEA anticipate fulfilling orders of Sixty (60) GrimWing units and Sixty (60) DireWing units using the BPAs.
Interested and capable PCB fabrication and/or PCB assembly vendors are highly encouraged to provide a proposal as instructed herein. Please see attached combined solicitation/synopsis, PWS for BPA scope, and the proposal
instructions and evaluation criteria. Phase I proposals are due to the contract specialist, Ryan Tung via e-mail to ryan.c.tung.civ@mail.mil, no later than 12:00pm (Pacific), Monday, 15 December 2025.
Notice ID: hq072725qrt04
Department/Ind. Agency: dept of defense
Original Set Aside: total small business set-aside (far 19.5)
Sub-tier: defense microelectronics activity (dmea)
Office: defense microelectronics activity
Product Service Code: 5998 - electrical and electronic assemblies, boards, cards, and associated hardware
NAICS Code: 334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing
Inactive Dates: dec 30, 2025
Inactive Policy: 15 days after date offers due
Documents
Procurement Documents for USA
Access a comprehensive library of standard procurement documents specific to USA. Here, you'll find all the essential forms, guidelines, and templates required for tender applications and submissions in USA
Want To Bid in This Tender?
Get Local Agent Support in USA and 60 More Countries.
View Tenders By
Sign in with Google