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DEPT OF DEFENSE | DEFENSE MICROELECTRONICS ACTIVITY (DMEA) has floated a tender for Multiple Award PCB Fab and Assembly BPAs 2026-2030. The project location is USA and the tender is closing on 15 Aug 2025. The tender notice number is HQ072725QRT04, while the TOT Ref Number is 123318983. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.
Procurement Summary
Country: USA
Summary: Multiple Award PCB Fab and Assembly BPAs 2026-2030
Deadline: 15 Aug 2025
Other Information
Notice Type: Tender
TOT Ref.No.: 123318983
Document Ref. No.: HQ072725QRT04
Financier: Self Financed
Purchaser Ownership: Public
Tender Value: Refer Document
Purchaser's Detail
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Login to see detailsTender Details
Description
DMEA's mission includes developing electronics solutions that solve DOD obsolescence issues and/or provides state of the art SatCom solutions to DOD Programs. As such, there is a need to (1) rapidly produce developmental Printed Circuit Board Assemblies (PCBAs) for initial design and development use, (2) quickly produce prototype PCBAs for design validation, and (3) manufacture high quality PCBAs for use in DOD operational environments.
DMEA intends to competitively issue multiple BPA agreements to all qualifying offerors, in accordance with FAR 13.106-1(a)(2)(iv). The purpose of this solicitation to is to competitively establish a pool of qualified BPA holders in order to rapidly obtain electronics products from industry and commercial PCB Fabrication and/or Assembly companies; specifically those produced by PCB Fabrication and PCB Assembly processes. Maximum ordering ceiling for each BPA holder is ($7.5million / divided by # of qualified offeror.)
No individual PCB orders will be awarded at this time, this Combined Synopsis/Solicitation is to competitively establish BPA agreeements with qualified vendors.
Interested and capable PCB fabrication and/or PCB assembly vendors are highly encouraged to provide a proposal as instructed herein. Please see attached combined solicitation/synopsis, PWS for BPA scope, proposal instructions and evaluation criteria, and DRAFT BPA Agreement language. Proposals are due to the contract specialist, Ryan Tung via e-mail to ryan.c.tung.civ@mail.mil, no later than 2:00pm (Pacific), Friday, 15 August 2025.
Active Contract Opportunity
Notice ID : HQ072725QRT04
Related Notice
Department/Ind. Agency : DEPT OF DEFENSE
Sub-tier : DEFENSE MICROELECTRONICS ACTIVITY (DMEA)
Office: DEFENSE MICROELECTRONICS ACTIVITY
General Information
Contract Opportunity Type: Combined Synopsis/Solicitation (Original)
Original Published Date: Jul 24, 2025 01:55 pm PDT
Original Date Offers Due: Aug 15, 2025 02:00 pm PDT
Inactive Policy: 15 days after date offers due
Original Inactive Date: Aug 30, 2025
Initiative: None
Classification
Original Set Aside: Total Small Business Set-Aside (FAR 19.5)
Product Service Code: 5998 - ELECTRICAL AND ELECTRONIC ASSEMBLIES, BOARDS, CARDS, AND ASSOCIATED HARDWARE
NAICS Code: 334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing
Place of Performance: USA
Documents
Combined-Synopsis-and-Solicitation-PWS-25-5E3-PCB.pdf
Procurement Documents for USA
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