DEPT OF DEFENSE | DEFENSE THREAT REDUCTION AGENCY (DTRA) has floated a tender for Microelectronics Request for Information. The project location is USA and the tender is closing on 26 Jan 2026. The tender notice number is HDTRA126RFI-Microelectronics, while the TOT Ref Number is 133249937. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.

Expired Tender

Procurement Summary

Country: USA

Summary: Microelectronics Request for Information

Deadline: 26 Jan 2026

Posting Date: 07 Jan 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 133249937

Document Ref. No.: HDTRA126RFI-Microelectronics

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

Purchaser's Detail

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Tender Details

THIS IS A REQUEST FOR INFORMATION (RFI) ONLY to identify microelectronic materials that can provide low size, weight, power, and cost. The information provided in the RFI is subject to change and is not binding on the Government. The Defense Threat Reduction Agency has not made a commitment to procure any of the items discussed, and release of this RFI should not be construed as such a commitment or as authorization to incur cost for which reimbursement would be required or sought. All submissions become Government property and will not be returned. Respondents shall provide a brief description on how they plan to develop or advance existing technologies/sensing materials for the identified applications as well as any anticipated technical parameters of their product (or conceptual product). Validation can include historical, literature data or relationship with current DOD researchers. Validation can also include investment from interagency past programs.

The Defense Threat Reduction Agency, Research and Development, Chemical and Biological Technologies directorate (DTRA RD-CB) in support of the Joint Program Executive Office for Chemical, Biological, Radiological, Nuclear Defense (JPEO-CBRND) is seeking information on innovative fusion of diverse components for high-performing microelectronics. The goal is to develop hybrid materials and semiconductors to reduce size, weight, power, and cost (SWaP-C) for microelectronics that will revolutionize sensor design and add value on high performance and functionality. The development of these components will feed into technologies that will provide rapid response times as well as reduce the burden to the General Forces by lowering the SWaP-C.

***For details and full RFI, please see the attachment associated with this announcement***
Notice ID: hdtra126rfi-microelectronics
Department/Ind. Agency: dept of defense
Sub-tier: defense threat reduction agency (dtra)
Office: defense threat reduction agency
Product Service Code: ac32 - national defense r&d services; defense-related activities; applied research
NAICS Code: 541512 - Computer Systems Design Services
Inactive Dates: feb 10, 2026
Inactive Policy: 15 days after response date

Documents

 Tender Notice


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