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The TECHNOLOGY RESEARCH CENTER VTT OY has issued a Tender notice for the procurement of a Metal Cmp and Brush Cleaner in the Finland. This Tender notice was published on 25 May 2026 and is scheduled to close on 25 May 2026, with an estimated Tender value of Refer Document. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 141968969, while the tender notice number is 596385 and Registering on the platform.
Procurement Summary
Country: Finland
Summary: Metal Cmp and Brush Cleaner
Deadline: 25 May 2026
Posting Date: 25 May 2026
Other Information
Notice Type: Tender
TOT Ref.No.: 141968969
Document Ref. No.: 596385
Competition: ICB
Financier: Self Financed
Purchaser Ownership: Public
Tender Value: Refer Document
Purchaser's Detail
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Email: Login to see tender_detailsLogin to see details Tender Details THE OBJECT OF THE PROCUREMENTThe procurement concerns the delivery of an automatic metal Chemical Mechanical Polishing (CMP) system with an integrated wafer cleaner for processing and planarization of 200 mm semiconductor wafers. The scope includes the fully configured CMP tool, integrated cleaning unit, required accessories, and delivery, installation, and commissioning.Tool is acquired for processing of following applications: 1. Copper and barrier polishing steps for a. Integrated passive componentsb. CMOS wafers Back-End-of-the-Line (BEOL) and Mid-End-of-the-Line (MEOL)c. Hybrid bondingd. Above structures may include also low K materials which need special cleaning methods2. Through-silicon via (TSV) a. overburden metallization removal b. Silicon, silicon dioxide and silicon nitride polishing during the TSV back side processing3. Quantum computing related materials polishing Tool to be acquired needs to be able to deliver industrial level quality & repeatability while allowing flexibility in research and technology organisation environment: polishing is done on both wafers that meet SEMI standards and wafers and wafer stacks with non-standard thicknesses, non-beveled edges with large edge exclusions & fragile edges. Single tool is acquired to serve several polishing processes that include copper, insulators and quantum related materials; several polishing platens for several consumable sets are needed. The polishing tool configuration is based on the above constraints. ... Documents
Published: 24/05/2026
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