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The NATIONAL RESEARCH AND DEVELOPMENT AGENCY RIKEN has issued a Tender notice for the procurement of a Manual Epoxy Die Bonder for Semiconductor Detector Development in the Japan. This Tender notice was published on 12 Nov 2025 and is scheduled to close on 26 Nov 2025, with an estimated Tender value of Refer Document. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 129954442, while the tender notice number is and Registering on the platform.
Procurement Summary
Country: Japan
Summary: Manual Epoxy Die Bonder for Semiconductor Detector Development
Deadline: 26 Nov 2025
Posting Date: 12 Nov 2025
Other Information
Notice Type: Tender
TOT Ref.No.: 129954442
Document Ref. No.:
Financier: Self Financed
Purchaser Ownership: Public
Tender Value: Refer Document
Purchaser's Detail
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Login to see detailsTender Details
Manual epoxy die bonder for semiconductor detector development Description: Manual epoxy die bonder for semiconductor detector development Purchase of goods, etc.Return to the list of purchase of goods, etc. Procurement project name Manual epoxy die bonder for semiconductor detector development Procurement form Publication date Bidding deadline Date Bid opening date Procurement department Responsible government procurement November 2025... Deadline: 2025-11-26 [Disclaimer: This notice does not specify a specific deadline, so we have added 15 days from the date of posting]
Documents
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