Procurement Summary
Country: Japan
Summary: Manual Epoxy Die Bonder for Semiconductor Detector Development 1 set
Deadline: 05 Jan 2026
Posting Date: 11 Nov 2025
Other Information
Notice Type: Tender
TOT Ref.No.: 129873360
Document Ref. No.:
Financier: Self Financed
Purchaser Ownership: Public
Tender Value: Refer Document
Purchaser's Detail
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Manual Epoxy Die Bonder for Semiconductor Detector Development 1 set
uClassification :
0024 Professional/Scientific & Controlling Instruments & Apparatus
Summay of Notice :
⑴ Contracting entity : Satoshi Hoshino, Director of Procurement Division, Fiscal Services and Procurement Group, RIKEN.
⑵ Classification of the products to be procured : 24
⑶ Nature and quantity of the products to be purchased : Manual Epoxy Die Bonder for Semiconductor Detector Development 1 set
⑷ Delivery period : 31, Mar, 2026
⑸ Delivery place : As specified in the specifications
⑹ Qualifications for participating in the tendering procedures : Suppliers eligible for participating in the proposed tender are those who shall ①not come under Article 5 of the Regulation concerning the Contract for RIKEN ②have the Grade A, Grade B or Grade C qualifications during fiscal year 2025 in manufacturing or selling business for participating in tenders by RIKEN, or in tenders by Single qualification for every ministry and agency ③prove to have prepared a system to provide rapid after-sale service and maintenance for the procured products
⑺ Time limit of tender : 3 : 00 PM, 5, Jan, 2026
⑻ Contact point for the notice : Yasushi Takahashi, Wako Procurement Section I, Procurement Division, Fiscal Services and Procurement Group, RIKEN. 2-1, Hirosawa, Wako-shi, Saitama, 351-0198, Japan, TEL 050-3500-6484.br
Documents
Tender Notice