Cross Icon
Cross Icon

Maintenance for Flip Chip Bonding Tool Tender in USA - 52544636

The NATIONAL AERONAUTICS AND SPACE ADMINISTRATION has issued a Tender notice for the procurement of a Maintenance for Flip Chip Bonding Tool in the USA. This Tender notice was published on 24 Apr 2021 and is scheduled to close on 28 Apr 2021, with an estimated Tender value of Refer Document. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 52544636, while the tender notice number is 80NSSC211517 and Registering on the platform.

Expired Tender

Procurement Summary

Country: USA

Summary: Maintenance for Flip Chip Bonding Tool

Deadline: 28 Apr 2021

Posting Date: 24 Apr 2021

Other Information

Notice Type: Tender

TOT Ref.No.: 52544636

Document Ref. No.: 80NSSC211517

Competition: ICB

Financier: Self Financed

Purchaser Ownership: -

Tender Value: Refer Document

Purchaser's Detail

Name: Login to see tender_details

Address: Login to see tender_details

Email: Login to see tender_details

Login to see details

Tender Details

Maintenance for Flip Chip Bonding Tool
Active Contract Opportunity
Notice ID : 80NSSC211517
Related Notice
Department/Ind. Agency : NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Sub-tier : NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Office : NASA SHARED SERVICES CENTER
General Information
Contract Opportunity Type: Presolicitation (Original)
All Dates/Times are: (UTC-04:00) EASTERN STANDARD TIME, NEW YORK, USA
Original Published Date: Apr 23, 2021 10:55 am EDT
Original Response Date: Apr 28, 2021 12:00 pm EDT
Inactive Policy: 15 days after response date
Original Inactive Date: May 13, 2021
Initiative: None
Classification
Original Set Aside: Total Small Business Set-Aside (FAR 19.5)
Product Service Code: R499 - SUPPORT- PROFESSIONAL: OTHER
NAICS Code: 541990 - All Other Professional, Scientific, and Technical Services
Place of Performance: Greenbelt, MD 20771 USA
Description
NASA/NSSC has a requirement for preventative maintenance contract covering our FC150 Flip Chip Bonder. These systems contain proprietary software designed specifically for the equipment.
NASA/NSSC intends to issue a sole source contract to JB TECHNICAL SUPPORT SERVICE 3020 E CLARENDON AVE PHOENIX ARIZONA 85016-7015 under the authority of FAR 13.106-1(b)(1)(i). The personnel performing this work must be appropriately trained on the specific systems, have availability of parts specific to the Goddard-owned e...

Documents

 Tender Notice


Request Demo
GiZ Tenders India

Procurement Documents for USA

Access a comprehensive library of standard procurement documents specific to USA. Here, you'll find all the essential forms, guidelines, and templates required for tender applications and submissions in USA

Explore Procurement Documents for USA


Want To Bid in This Tender?

Get Local Agent Support in USA and 60 More Countries.

View All The Services


View Tenders By


Publish Tenders


Have Any Dispute With The Purchaser?