Low Noise Sliprings for Solar Array Drive Tender - 108208919

The EUROPEAN SPACE RESEARCH AND TECHNOLOGY CENTRE has issued a Tender notice for the procurement of a Low Noise Sliprings for Solar Array Drive Mechanisms in the Netherlands. This Tender notice was published on 05 Oct 2024 and is scheduled to close on 22 Nov 2024, with an estimated Tender value of Refer Document. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 108208919, while the tender notice number is 1-11156 and Registering on the platform.

Expired Tender

Procurement Summary

Country: Netherlands

Summary: Low Noise Sliprings for Solar Array Drive Mechanisms

Deadline: 22 Nov 2024

Posting Date: 05 Oct 2024

Other Information

Notice Type: Tender

TOT Ref.No.: 108208919

Document Ref. No.: 1-11156

Competition: ICB

Financier: Agency for the Cooperation of Energy Regulators (ACER)

Purchaser Ownership: Public

Tender Value: Refer Document

Purchaser's Detail

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Tender Details

Tenders are invited for Low Noise Sliprings for Solar Array Drive Mechanisms (Artes at 4e.085) (Re-Issue)
The objective of the activity is to develop, manufacture and test a low noise slipring breadboard assembly for solar array drive mechanisms. Targeted Improvements: Reduction of the slipring noise by at least 3 orders of magnitude with respect to the worst measured noise on current slipring technology. Description: A slipring of a solar array drive mechanism is an electrically conductive rotating track transferring low level signals and high current signals from the solar array to the power conditioning unit of the spacecraft. Today, mature European products are available, however often they are not competitive in terms of slipring noise performance. Recent advancements in contact material research are now paving the way towards at least three orders of magnitude lower slipring noise than the worst measured performance on current European technology. This activity will design and manufacture a slipring breadboard implementing novel low noise contact technologies and concepts, as needed for large telecommunication satellites. The design trade-offs shall identify options to reduce complexity and part count. The targeted hardware is a slipring assembly with a power handling capability suitable for telecommunication missions. Experimental tests in a laboratory environment will be carried out to fully evaluate the developed technologies and concepts. This will include an endurance test to confirm the suitability for telecommunication applications

Documents

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