Procurement Summary
Country: Japan
Summary: Layout Design of the Application Test Chip for Lowcost Dietodie Interface, 1 Set
Deadline: 17 Jun 2026
Posting Date: 31 Oct 2026
Other Information
Notice Type: Tender
TOT Ref.No.: 151776735
Document Ref. No.:
Competition: ICB
Financier: Self Financed
Purchaser Ownership: Public
Tender Value: Refer Document
Purchaser's Detail
Name: Login to see tender_details
Address: Login to see tender_details
Email: Login to see tender_detailsLogin to see details
Tender Details
Layout Design of the Application Test Chip for Lowcost DietoDie Interface, 1 Set
Classification: 0027 Computer Services 0071 Computer & Related Services
Summay of Notice: ⑴ Official in charge of disbursement of the procuring entity : FUJII Teruo, President of the University of Tokyo ⑵ Classification of the services to be procured : 71, 27 ⑶ Nature and quantity of the services to be required : Layout Design of the Application Test Chip for Low-cost Die-to-Die Interface, 1 Set ⑷ Fulfillment period : By 30 November, 2026 ⑸ Fulfillment place : Graduate School of Engineering, The University of Tokyo ⑹ Qualifications for participating in the tendering procedures : Suppliers eligible for participating in the proposed tender are those who shall : ADE The same with the Notice above (No.85) B have the Grade A, Grade B or Grade C qualification during fiscal 2026 in the Kanto-Koshinetsu area in offer of services for participating in tenders by Single qualification for every ministry and agency, C prove to have prepared a system to provide rapid after-sale service for the procured services, ⑺ Time limit of the documents : 17 : 00 27 May, 2026 ⑻ Contact point for the notice : SAKAIZUMI hajime, Contract Group, Finance Department, The University of Tokyo, 7-3-1 Hongo Bunkyo-ku Tokyo 113-8654 Japan, TEL 03-5841-2148, URL : https://www.u-tokyo.ac.jp/ja/ about/procurement-contracts/nyusatsu/ index.php ⑼ Please be noted that if it is indicated that environmental conditions relating to the procurement are laid down in its tender documents.
Documents
Tender Notice