Procurement Summary
Country: Japan
Summary: Layout Design of the Application Test Chip for Lowcost DietoDie Interface, 1 Set
Deadline: 27 May 2026
Posting Date: 01 May 2026
Other Information
Notice Type: Tender
TOT Ref.No.: 140501892
Document Ref. No.:
Competition: ICB
Financier: Self Financed
Purchaser Ownership: Public
Tender Value: Refer Document
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Layout Design of the Application Test Chip for Lowcost DietoDie Interface, 1 Set
Classification :
0027 Computer Services 0071 Computer & Related Services
Summay of Notice :
⑴ Official in charge of disbursement of the procuring entity : FUJII Teruo, President of the University of Tokyo
⑵ Classification of the services to be procured : 71, 27
⑶ Nature and quantity of the services to be required : Layout Design of the Application Test Chip for Low-cost Die-to-Die Interface, 1 Set
⑷ Fulfillment period : By 30 November, 2026
⑸ Fulfillment place : Graduate School of Engineering, The University of Tokyo
⑹ Qualifications for participating in the tendering procedures : Suppliers eligible for participating in the proposed tender are those who shall :
ADE The same with the Notice above (No.85)
B have the Grade A, Grade B or Grade C qualification during fiscal 2026 in the Kanto-Koshinetsu area in offer of services for participating in tenders by Single qualification for every ministry and agency,
C prove to have prepared a system to provide rapid after-sale service for the procured services,
⑺ Time limit of the documents : 17 : 00 27 May, 2026
⑻ Contact point for the notice :
SAKAIZUMI hajime, Contract Group, Finance Department, The University of Tokyo, 7-3-1 Hongo Bunkyo-ku Tokyo 113-8654 Japan, TEL 03-5841-2148,
URL : https://www.u-tokyo.ac.jp/ja/
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⑼ Please be noted that if it is indicated that environment...
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Tender Notice