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The LANZHOU UNIVERSITY has issued a Tender notice for the procurement of a Lanzhou University School of Information Science and Engineering's New Semiconductor Wafer, Device Production, Circuit Board Design and Performance Testing Service Procurement Project (Second Bid Section Three Times) Public Bidding Announcement in the China. This Tender notice was published on 21 Oct 2026 and is scheduled to close on 28 Oct 2026, with an estimated Tender value of Refer Document. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 151233832, while the tender notice number is LZU-2026-145-FW-GK and Registering on the platform.
Procurement Summary
Country: China
Summary: Lanzhou University School of Information Science and Engineering's New Semiconductor Wafer, Device Production, Circuit Board Design and Performance Testing Service Procurement Project (Second Bid Section Three Times) Public Bidding Announcement
Deadline: 28 Oct 2026
Posting Date: 21 Oct 2026
Other Information
Notice Type: Tender
TOT Ref.No.: 151233832
Document Ref. No.: LZU-2026-145-FW-GK
Competition: ICB
Financier: Self Financed
Purchaser Ownership: Public
Tender Value: Refer Document
CPV Classification
31712330 - SemiconductorsPurchaser's Detail
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Email: Login to see tender_detailsLogin to see details Tender Details Lanzhou University School of Information Science and Engineering's new semiconductor wafer, device production, circuit board design and performance testing service procurement project (second bid section three times) public bidding announcement Documents
Budget amount: 76.000000 yuan
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