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La3215c-Ucc-Cft for the Supply of a Suite Tender - 143463846

The EDUCATION PROCUREMENT SERVICE (EPS) has issued a Tender notice for the procurement of a La3215c-Ucc-Cft for the Supply of a Suite of Plasma Etcher and Plasma Deposition Tools, 4 Lots in the Ireland. This Tender notice was published on 17 Jun 2026 and is scheduled to close on 17 Jul 2026, with an estimated Tender value of EUR 3300000. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 143463846, while the tender notice number is 415187-2026 and Registering on the platform.

Expired Tender

Procurement Summary

Country: Ireland

Summary: La3215c-Ucc-Cft for the Supply of a Suite of Plasma Etcher and Plasma Deposition Tools, 4 Lots

Deadline: 17 Jul 2026

Posting Date: 17 Jun 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 143463846

Document Ref. No.: 415187-2026

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: EUR 3300000

CPV Classification

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Purchaser's Detail

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Tender Details

Plasma Etcher, Silicon, Dielectrics Plasma Etcher, Metals, Piezoelectrics Plasma Etcher, Slow and Controllable Rate, Atomic Layer Etch for Silicon, Dielectrics Plasma Deposition, PECVD
Tenders are sought for the supply delivery, installation and commissioning of a suite of tools in 4 Lots for silicon-based and dielectric materials for University College Cork. The new plasma tools will enhance the capabilities at the Tyndall National Institute for the fabrication of semiconductor devices, especially silicon microelectronics and silicon MEMS, but also other materials such as germanium and silicon carbide. We invite proposals for the following lots; Lot 1 Plasma Etcher Silicon Dielectrics, advanced plasma etching system capable of etching for polysilicon poly-Si silicon dioxide SiO2 silicon nitride SiN thin films using medium high-density plasma processes. Lot 2 Plasma Etcher Metals Piezoelectrics, advanced plasma etching system capable of etching for aluminium Al and alloys molybdenum Mo aluminium scandium nitride AlScN thin films using medium high-density plasma processes. Lot 3 Plasma Etcher Slow and Controllable Rate Atomic Layer Etch for Silicon Dielectrics, advanced plasma etching system capable of both conventional high-rate etching and slow and controllable rate atomic layer etching for silicon Si silicon dioxide SiO2 silicon nitride SiN thin films using medium high-density plasma processes. Lot 4 Plasma Deposition PECVD, advanced plasma enhanced chemical vapour dep...
Document Type: Contract Notice

Contract Type: supplies

Estimated Value: 3300000 - EUR

Authority Type: body-pl

Doc Title: LA3215C-UCC-CFT for the Supply of a Suite of Plasma Etcher and Plasma Deposition Tools, 4 Lots

Dispatch Date: 2026-06-16

Publish Date: 2026-06-17

Submission Date: 2026-07-17

Documents

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