Integrated Uhv Cluster for Pulsed Laser Deposition Tender - 142449750

Procurement Summary

Country: Switzerland

Summary: Integrated Uhv Cluster for Pulsed Laser Deposition and Sputtering of Thin Films

Deadline: 12 Jul 2026

Posting Date: 02 Jun 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 142449750

Document Ref. No.: 377893-2026

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

CPV Classification

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Purchaser's Detail

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Tender Details

Integrierter UHV-Cluster für gepulste Laserdeposition (PLD) und Sputterdeposition von Dünnschichten
The Laboratory of Inorganic Chemistry at ETH Zurich plans to procure an integrated UHV cluster for pulsed laser deposition and sputtering of heterostructures containing oxide and metallic layers. The system will enable materials synthesis on oxide substrates up to 10 x 10 mm2 in area. It shall comprise a PLD chamber, a sputtering chamber, a central UHV transfer/handling chamber, and a load-lock for sample and PLD target-carousel exchange without venting the process chambers. All chambers must have base pressures below 1 x 10-7 mbar. The PLD chamber must include a KrF excimer laser, in-situ high-pressure RHEED and be suitable for routine high-temperature epitaxial oxide growth around 1100 °C. The sputtering chamber must allow DC and RF magnetron sputtering of metallic and oxide layers, including reactive sputtering in Ar/O₂ atmospheres, with substrate heating up to at least 700 °C using a carrier concept compatible with PLD. The system must allow sample transfer to an external UHV vacuum suitcase, and retain UHV-compatible ports for future expansion of the cluster. Further details see specification document.
Doc Title: Integrated UHV Cluster for Pulsed Laser Deposition and Sputtering of Thin Films
Contract Type: supplies
Document Type: Contract Notice

Contract Type: supplies

Authority Type: body-pl

Doc Title: Integrated UHV Cluster for Pulsed Laser Deposition and Sputtering of Thin Films

Dispatch Date: 2026-06-01

Publish Date: 2026-06-02

Submission Date: 2026-07-12

Documents

 Tender Notice