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Inductively Coupled Plasma Reactive Ion Etching Procurement Plan/GPN/PIN - 144072184

The OULUN YLIOPISTO has issued a Procurement Plan/GPN/PIN notice for the procurement of a Inductively Coupled Plasma Reactive Ion Etching (Icp-Rie) System in the Finland. This Procurement Plan/GPN/PIN notice was published on 26 Jun 2026 and is scheduled to close on 10 Aug 2026, with an estimated Procurement Plan/GPN/PIN value of Refer Document. Interested bidders can access detailed Procurement Plan/GPN/PIN information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 144072184, while the tender notice number is 441853-2026 and Registering on the platform.

Expired Tender

Procurement Summary

Country: Finland

Summary: Inductively Coupled Plasma Reactive Ion Etching (Icp-Rie) System

Deadline: 10 Aug 2026

Posting Date: 26 Jun 2026

Other Information

Notice Type: Procurement Plan/GPN/PIN

TOT Ref.No.: 144072184

Document Ref. No.: 441853-2026

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

CPV Classification

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Purchaser's Detail

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Tender Details

Inductively Coupled Plasma Reactive Ion Etching (ICP-RIE) System
University of Oulu is preparing a purchase of an inductively coupled plasma reactive ion etching (ICP-RIE) system. The system will be used in scientific research to fabricate microstructures for various applications, such as biomedicine, sensor technology, and optics. For more information, please contact the contracting unit to organize a dialogue by 10.8.2026 at the address: [email protected]. Please note that contracting authority is on summer holiday during 11.7.-2.8.2026.
Doc Title: Inductively Coupled Plasma Reactive Ion Etching (ICP-RIE) System
Contract Type: supplies
Document Type: Prior Information Notice

Reference Number: 599890

Contract Type: supplies

Authority Type: body-pl

Doc Title: Inductively Coupled Plasma Reactive Ion Etching (ICP-RIE) System

Dispatch Date: 2026-06-25

Publish Date: 2026-06-26

Submission Date: 2026-08-10

Documents

 Tender Notice


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