Procurement Summary
Country : China
Summary : Icb of Multifunctional Micromechanical Testing System for Shanghai Integrated Circuit Materials Research Institute Co., Ltd
Deadline : 27 Jun 2023
Other Information
Notice Type : Tender
TOT Ref.No.: 83599937
Document Ref. No. : 0705-234006077007
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : Refer Document
Purchaser's Detail
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Login to see detailsTender Details
Project Name: ICB of Multifunctional Micromechanical Testing System for Shanghai Integrated Circuit Materials Research Institute Co., Ltd
Tenders are invited for Multifunctional Micromechanical Testing System
Products List:
1: Multifunctional Micromechanical Testing System
Place of Implementation: Shanghai
Beginning of Selling Bidding Documents: 2023-05-29
Ending of Selling Bidding Documents: 2023-06-05
Price of Bidding Documents: ¥1000/$150
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time): 2023-06-27 10:00
Documents
Tender Notice