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COMMERCE, DEPARTMENT OF | NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY has floated a tender for HighPerformance 3D Digital Image Correlation DIC System. The project location is USA and the tender is closing on 24 Dec 2025. The tender notice number is NIST-SS26-CHIPS-46, while the TOT Ref Number is 131848903. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.
Procurement Summary
Country: USA
Summary: HighPerformance 3D Digital Image Correlation DIC System
Deadline: 24 Dec 2025
Posting Date: 11 Dec 2025
Other Information
Notice Type: Tender
TOT Ref.No.: 131848903
Document Ref. No.: NIST-SS26-CHIPS-46
Financier: Self Financed
Purchaser Ownership: Public
Tender Value: Refer Document
Purchaser's Detail
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Login to see detailsTender Details
The purpose of this sources sought notice is to conduct market research and identify potential sources of commercial products/services that satisfy the Government-s anticipated needs.
BACKGROUND
The National Institute of Standards and Technology (NIST), Gaithersburg 731.07 Group within the Engineering Laboratory is seeking a High-Performance 3D Digital Image Correlation (DIC) System capable of precise, in-situ, full-field displacement and strain measurement under various thermal and mechanical loading conditions. This system is critical for developing new multi-stress accelerated laboratory testing methodologies and acquiring the fundamental physical data required to develop accurate Finite Element Analysis (FEA)-based failure prediction models.
Current reliability practices are not equipped to address new failure mechanisms—such as cracking, melting, and interfacial debonding—induced by the increased localized heat production and mismatch of coefficients of thermal expansion (CTE) in 3D heterogeneously integrated devices. This DIC system will be used for in-situ monitoring of package and assembly deformation during service cycles to characterize the thermo-mechanical reliability of advanced electronic packaging, including measuring:
Warpage and out-of-plane deformation during thermal cycling.
Local strain accumulation due to CTE mismatch at material interfaces.
Material and interfacial property changes under multiple simultaneous environmental stressors (temperature, moisture, and thermal cycling).
This work is in direct support of the CHIPS Metrology program (https://www.nist.gov/chips/research-development-programs/metrology-program), specifically addressing Grand Challenge 3: "Enabling Metrology for Integrating Components in Advanced Packaging."
NIST is seeking information from sources that may be capable of providing a solution that will achieve the objectives described above, in addition to the following essential requirements:
I....
Notice ID: nist-ss26-chips-46
Department/Ind. Agency: commerce, department of
Sub-tier: national institute of standards and technology
Office: dept of commerce nist
Product Service Code: 6640 - laboratory equipment and supplies
NAICS Code: 334516 - Analytical Laboratory Instrument Manufacturing
Inactive Dates: jan 08, 2026
Inactive Policy: 15 days after response date
Documents
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