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Fudan University Public Tender Announcement Tender - 149519779

The FUDAN UNIVERSITY has issued a Tender notice for the procurement of a Fudan University Public Tender Announcement for Active Silicon Interposer Chip Packaging and Processing Services in the China. This Tender notice was published on 21 Sep 2026 and is scheduled to close on 28 Sep 2026, with an estimated Tender value of Refer Document. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 149519779 and Registering on the platform.

Procurement Summary

Country: China

Summary: Fudan University Public Tender Announcement for Active Silicon Interposer Chip Packaging and Processing Services

Deadline: 28 Sep 2026

Posting Date: 21 Sep 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 149519779

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Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

Purchaser's Detail

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Documents

Tender Notice

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