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ENERGY, DEPARTMENT OF has floated a tender for FlipChip Bonding. The project location is USA and the tender is closing on 24 Apr 2025. The tender notice number is SLAC_354410_Flipchipbonding, while the TOT Ref Number is 117479549. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.
Procurement Summary
Country : USA
Summary : FlipChip Bonding
Deadline : 24 Apr 2025
Other Information
Notice Type : Tender
TOT Ref.No.: 117479549
Document Ref. No. : SLAC_354410_Flipchipbonding
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : Refer Document
Purchaser's Detail
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Login to see detailsTender Details
Description
SLAC National Accelerator Laboratory is operated by Stanford University for the Department of Energy. As a management and operating contractor, subcontracts awarded by the Laboratory are not Federal procurements, and are not directly subject to the Federal Acquisition Regulations in 48 CFR. Nonetheless, certain Federal laws, Executive Orders, and regulations may affect our DOE approved purchasing system, as required by statute, regulation, or contract terms and conditions.
This is a formal request for quotation from Procurement as requirement has been assigned to me as a buyer.
**Please do not contact the requester regarding the item(s) in this request while we are in the process of bidding to maintain the integrity of this solicitation.
Please review the quote and provide your best and final offer for both price and lead-time.
Kindly also have the quotation revised to today-s date and address the quote to my attention.
The follow has been attached for you to complete and review:
(BAA) Buy American Act Certification International Representations & Certifications Rider Confirm Attached SLAC terms are accepted: FP Commercial Supplies-Services T&Cs (August 2023) SOWRequired item(s) listed below:
Qty: 45 pieces - product description: 2x3 modules (6 ROC chips per sensor chip) Qty: 15 pieces - product description: 2x2 modules (4 ROC chips per sensor chip) Qty: 15 pieces - product description: 2x1 modules (2 ROC chips per sensor chip) Qty: 45 pieces - product description: 1x1 modules (1 ROC chips per sensor chip)
Quote is for product only; no on-site services permitted.
Source selection will be based on Lowest Price and Technically Acceptable Method (LPTA).
Technical evaluation criteria are as follows:
Ability to meet the following specs: Adhere to SOW Technical Criteria below1
Bump-to-bump pitch in both dimensions of 100 microns
2
Bump material eutectic SnPb solder
3
Li...
Active Contract Opportunity
Notice ID : SLAC_354410_Flipchipbonding
Related Notice
Department/Ind. Agency : ENERGY, DEPARTMENT OF
Sub-tier : ENERGY, DEPARTMENT OF
Office: SLAC Natl Accel Lab -DOE Contractor
General Information
Contract Opportunity Type: Solicitation (Original)
Original Published Date: Apr 09, 2025 01:15 pm PDT
Original Date Offers Due: Apr 24, 2025 05:00 pm PDT
Inactive Policy: 15 days after date offers due
Original Inactive Date: May 09, 2025
Initiative: None
Classification
Original Set Aside:
Product Service Code: AJ12 - GENERAL SCIENCE AND TECHNOLOGY R&D SERVICES; GENERAL SCIENCE AND TECHNOLOGY; APPLIED RESEARCH
NAICS Code: 334419 - Other Electronic Component Manufacturing
Place of Performance: Menlo Park, CA 94025 USA
Documents
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