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Edge-Handling Sputtering Cluster Tool Tender in Finland - 146740808

The TECHNOLOGY RESEARCH CENTER VTT OY has issued a Tender notice for the procurement of a Edge-Handling Sputtering Cluster Tool in the Finland. This Tender notice was published on 07 Aug 2026 and is scheduled to close on 24 Aug 2026, with an estimated Tender value of Refer Document. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 146740808, while the tender notice number is REG. NO 19/206/2026 and Registering on the platform.

Procurement Summary

Country: Finland

Summary: Edge-Handling Sputtering Cluster Tool

Deadline: 24 Aug 2026

Posting Date: 07 Aug 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 146740808

Document Ref. No.: REG. NO 19/206/2026

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

Purchaser's Detail

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Tender Details

The object of the tender process is an edge-handling sputtering cluster tool (later also “Equipment”). The Equipment is a sputtering cluster tool for 200-mm wafers with wafer edge-handling capability for the VTT Micronova cleanroom semiconductor front end. The procurement includes a deposition chamber with four magnetron sputtering sources. During transport and processing, the wafers are mechanically touched only at the wafer edge, and they can be flipped in vacuum between the processes.The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents.
Published: 07/08/2026 Deadline for submitting questions: 13/08/2026 Deadline for tenders: 24/08/2026

Documents

Tender Notice

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