Procurement Summary
Country : Poland
Summary : Delivery of Two Identical Advanced Surface Grinding Systems Designed Specifically for Grinding Semiconductor Substrates, such as Gall Nitride (Gan) and Silicon Carbide (Sic).
Deadline : 07 Jul 2025
Other Information
Notice Type : Tender
TOT Ref.No.: 120605492
Document Ref. No. : 370169-2025
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : Refer Document
Purchaser's Detail
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The subject of the order is "Delivery of two identical advanced surface grinding systems designed specifically for grinding semiconductor substrates, such as gallium nitride (GAN) and silicon carbide (sic)."
Purchase of two identicalgrinder:
Requirements for the specification of grinders
• grinder designed specifically for grinding semiconductor wafers, such as gallium nitride (GAN) and silicon carbide (sic).
• single -shaped grinder for processing waffles individually
• Possibility of processing waffles with a diameter from 25 mm to 150mm
• Possibility to use grinding discs from any supplier
Dimensions of the grinder:
• base area: less than: 1.5 m (width) x 2.2 m (depth) x 2.5 m (height)
• Weight: less than: 5 tons
sanding platform:
• spindle stiffness: at least 1 ym/500 n
• rated moment: 22 nm
• regulationsloping of the grinding disc in the axis with 3-point support
• feed speed: 5 mm/s
• cutting: 0.01 (10.0) μm/s
• resolution for the axis with: 0.01 μm
measuring the thickness of wafer:
• The measuring function of the thickness of the processed element in real time
working table:
• rotational speed: minimum 300 speed: rpmSupported sizes of workpiece, available working tables:
0 25.4 mm
0 49 mm
0 50.8 mm
0 101.6 mm
• porous material: Ceramics
grinding disc:
• Diameter of the grinding disc: from 200 mm to 300 mm
• rotational speed of the disc: minimum 2500 rpm.SZL ...
Document Type: Contract Notice
Reference Number: ZP-271/03/2025
Contract Type: Supplyies
Authority Type: Body-PL
doc Title: Delivery of two identical advanced sanding systems designed specifically designed for sanding semi-conductor substrates, such as gall nitride (gan)i węglik krzemu (SiC).
Dispatch Date: 2025-06-06
Publish Date: 2025-06-10
Submission Date: 2025-07-07
Documents
Tender Notice