EUROPEAN SPACE RESEARCH AND TECHNOLOGY CENTRE has floated a tender for Dc/Dc Converter with High Voltage Input. The project location is Netherlands and the tender is closing on 12 Sep 2024. The tender notice number is 1-11712, while the TOT Ref Number is 102838627. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.

Expired Tender

Procurement Summary

Country : Netherlands

Summary : Dc/Dc Converter with High Voltage Input

Deadline : 12 Sep 2024

Other Information

Notice Type : Tender

TOT Ref.No.: 102838627

Document Ref. No. : 1-11712

Financier : International Telecommunication Union (ITU)

Purchaser Ownership : Public

Tender Value : Refer Document

Purchaser's Detail

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Tender Details

Tenders are invited for Dc/Dc Converter with High Voltage Input for High Power Telecom Satellites (Artes 4.0 at 4f.165)

The objective of the activity is to design, manufacture and test a DC/DC converter (at least 1kW and up to 5kW range) breadboard with an input voltage of up to 300 V.Targeted Improvements:- Increase bus voltage levels up to 300 V, - Reduce harness mass by more than 100 kg (in high power platforms), - Reduce power losses by 90%.Description:Current electrical units only operate up to 100 V. However, employing bus voltages in excess of 100V, could significantly reduce DC power losses and the mass of DC harnesses. However, today there is no DC/DC converter available for input voltages of up to 300V. EEE technologies are available, such as GaN switches that are rated to 650 V. Moreover, in the terrestrial world 300 V applications are commonplace since the rectified mains voltage is 325V. Thus, a high voltage DC/DC converter is within reach.This activity will develop and experimentally test a breadboard of a DC/DC converter with an input voltage of 120V to 300V and an output power in the range of up to 5kW. This includes the development of a thermal management concept and part of the activity is the evaluation of highly dissipative components and critical breadboarding of electronic drivers.Read more

Documents

 Tender Notice


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