CMOSSilicon Based Wafer for Fabrication of Simple Tender - 146639556

The NATIONAL UNIVERSITY CORPORATION has issued a Tender notice for the procurement of a CMOSSilicon Based Wafer for Fabrication of Simple TEG and Highspeed MRAM Test Chip 1 set in the Japan. This Tender notice was published on 06 Aug 2026 and is scheduled to close on 01 Sep 2026, with an estimated Tender value of Refer Document. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 146639556, while the tender notice number is and Registering on the platform.

Expired Tender

Procurement Summary

Country: Japan

Summary: CMOSSilicon Based Wafer for Fabrication of Simple TEG and Highspeed MRAM Test Chip 1 set

Deadline: 01 Sep 2026

Posting Date: 06 Aug 2026

Other Information

Notice Type: Tender

TOT Ref.No.: 146639556

Document Ref. No.:

Competition: ICB

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

Purchaser's Detail

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Tender Details

CMOSSilicon Based Wafer for Fabrication of Simple TEG and Highspeed MRAM Test Chip 1 set
Classification: 0026 Miscellaneous Articles

Summay of Notice: ⑴ The same as the notice above No.30.

⑵ Classification of the products to be procured : 26

⑶ Nature and quantity of the products to be purchased : CMOS-Silicon Based Wafer for Fabrication of Simple TEG and High-speed MRAM Test Chip 1 set

⑷ Delivery period : By 3 December, 2026

⑸ Delivery place : Center for Innovative Integrated Electronic Systems, Tohoku University

⑹ Qualifications for participating in the tendering procedures : Suppliers eligible for participating in the proposed tender are those who shall :

A The same as the notice above No.30.

B have the Grade A, Grade B or Grade C qualification during fiscal 2026 in the Tohoku area in manufacture for participating in tenders by Single qualification for every ministry and agency, or in tenders by Tohoku University,

C The same as the notice above No.30.

D The same as the notice above No.30.

⑺ Deadline for submission of documents : 17 : 00 1 September, 2026

⑻ The same as the notice above No.30.

⑼ The same as the notice above No.30.

Documents

 Tender Notice


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