CHIPS RD Electricalthermal TEM holder Combined Sources SoughtNotice of Intent to... Tender

Procurement Summary

Country: USA

Summary: CHIPS RD Electricalthermal TEM holder Combined Sources SoughtNotice of Intent to Sole Source

Deadline: 26 Dec 2025

Other Information

Notice Type: Tender

TOT Ref.No.: 132010172

Document Ref. No.: NIST-SS26-CHIPS-51

Financier: Self Financed

Purchaser Ownership: Public

Tender Value: Refer Document

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Tender Details

***THIS IS A COMBINED SOURCES SOUGHT NOTICE AND NOTICE OF INTENT TO SOLE SOURCE***

The semiconductor supply chain is global, specialized, and interconnected. Chipmakers do business with thousands of individual suppliers that provide the highly complex materials and tools used to produce semiconductors. To address the lack of complete visibility into the semiconductor market's supply chain and R&D ecosystem gaps, NIST will advance the measurement science or metrology, critical to developing new materials, packaging, and production methods in chip manufacturing. Project GC1.01 will work with US manufacturers to improve manufacturing processes and evaluate the market readiness of advanced materials in next-generation electronics, such as two-dimensional (2D) and wide band gap (WBG) semiconductors. In a proposed measurement, an aberration-corrected electron beam will be used to measure atomic-level inhomogeneity that causes material degradation and device failure at the sub-nanometer scale. Simultaneously, an electron beam-induced current that travels across the failing material or device carries spectroscopic information that can be used to identify the root cause of performance loss. Analyzing atomic-level inhomogeneity and performance loss mechanisms simultaneously sheds light on the structure and chemistry at the early stage of material degradation and device failure.

Division 642, Materials Science and Engineering Division (MSED) at the National Institute of Standards and Technology (NIST) is an organization whose mission includes developing techniques for structure and property measurements in CHIPS-relevant materials at the nanoscale under working conditions. Currently, the environmental transmission electron microscope (ETEM), of which capabilities include high-spatial-resolution imaging, electron diffraction, and analytical spectroscopy techniques, such as electron energy-loss spectroscopy (EELS), energy-dispersive X-ray spectroscopy (EDS), cathodolumine...
Notice ID: nist-ss26-chips-51
Department/Ind. Agency: commerce, department of
Sub-tier: national institute of standards and technology
Office: dept of commerce nist
Product Service Code: 6640 - laboratory equipment and supplies
NAICS Code: 334419 - Other Electronic Component Manufacturing
Inactive Dates: jan 10, 2026
Inactive Policy: 15 days after response date

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