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ANHUI HUAxIN WEINA INTEGRATED CIRCUIT CO., LTD. has floated a tender for Bonding Aligners for 8-Inch Mems Wafer Production Lines. The project location is China and the tender is closing on 31 May 2024. The tender notice number is 0709-244035614016, while the TOT Ref Number is 101139302. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.
Procurement Summary
Country : China
Summary : Bonding Aligners for 8-Inch Mems Wafer Production Lines
Deadline : 31 May 2024
Other Information
Notice Type : Tender
TOT Ref.No.: 101139302
Document Ref. No. : 0709-244035614016
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : Refer Document
Purchaser's Detail
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Login to see detailsTender Details
Project Name: Bonding aligners for 8-inch MEMS wafer production lines
Tenders are invited for Device Name: Bonding Alignment Machine
Products List:
1: Bonding Alignment Machine
Place of Implementation: Anhui Province
Beginning of Selling Bidding Documents: 2024-05-11
Ending of Selling Bidding Documents: 2024-05-17
Price of Bidding Documents: ￥1500/$210
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time): 2024-05-31 09:30
Documents
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