Procurement Summary
Country : Finland
Summary : Automatic Bonder
Deadline : 02 Apr 2024
Other Information
Notice Type : Tender
TOT Ref.No.: 98914254
Document Ref. No. : 2024-143801
Competition : ICB
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : Refer Document
Purchaser's Detail
Purchaser : UNIVERSITY OF HELSINKI
University Of Helsinki
Yliopistonkatu 3, Helsinki, Finland - 00100
Finland
Email :hankinnat@helsinki.fi
URL :http://www.oikeus.fi/markkinaoikeus
Tender Details
An Automatic Bonder (fine Pitch Wedge To Wedge Wire Bonding And Single Point Tape Automated Bonding (sp-tab)) Will Be Acquired For The Joint Detector Laboratory Of The Helsinki Institute Of Physics And The University Of Helsinki.
Contract type: Purchase of goods
NUTS code: Helsinki-Uusimaa (FI1B)
Procedure nature: Open Procedure
Documents
Tender Notice