WESTERN PARKLAND CITY AUTHORITY has floated a tender for Amrf Semiconductor Facility Adviser. The project location is Australia and the tender is closing on 25 Jan 2024. The tender notice number is WPCA-AMRF2-23-001, while the TOT Ref Number is 94111083. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.

Expired Tender

Procurement Summary

Country : Australia

Summary : Amrf Semiconductor Facility Adviser

Deadline : 25 Jan 2024

Other Information

Notice Type : Tender

TOT Ref.No.: 94111083

Document Ref. No. : WPCA-AMRF2-23-001

Financier : Self Financed

Purchaser Ownership : Public

Tender Value : Refer Document

Purchaser's Detail

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Tender Details

Western Parkland City Authority (Wpca) Is The Owner And Operator Of The Advanced Manufacturing Research Facility (Amrf) In Bradfield City Centre (Bradfield). The Amrf, Currently Under Development, Will Be A Shared-Use Platform That Operates At An Industrial Scale. The Amrf Will Enable Its Customers To Develop Manufacturing Capability And Easily Transfer That Capability To Real-World Production. It Will Play An Important Role In Accelerating The Adoption Of Advanced Technology For Manufacturers In Western Sydney And Nsw And Activating The Local Manufacturing Ecosystem. The First Stage Of The Amrf (Amrf First Facility) Will Include Advanced Mechanical-Based Manufacturing Capabilities To Support A Range Of Applications And Demonstrate Enhanced Productivity And Quality In Manufacturing Systems - Construction Is Currently Underway, And The Building Is Scheduled For Completion In Q3 2024. The Second Stage Of The Amrf (Amrf Facility 2) Is Scheduled To Open Late 2026 In A Separate, Purpose-Built Facility. It Will Focus On Advanced Semiconductor And Electronics Manufacturing To Address Capability Needs In Industries Such As Defence And Aerospace, As Well As Catalysing Growth Of Emerging Electronics Industries. Amrf Facility 2 Aims To Establish A Competitive Edge In The Global Semiconductor Ecosystem Through The Manufacture Of Low Volume, High Value Advanced Packaging For Semiconductors At Development And Pilot Scale Using Equipment And Technologies For Commercial Production. It Will...
Closing date : 25-Jan-2024 14:00

Documents

 Tender Notice


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