Procurement Summary
Country: Spain
Summary: Acquisition of an Ion Implantation Equipment by Immersion in Plasma (Piii)
Deadline: 06 Aug 2025
Other Information
Notice Type: Tender
TOT Ref.No.: 123189187
Document Ref. No.: 482484-2025
Financier: Self Financed
Purchaser Ownership: Public
Tender Value: EUR 590000
Purchaser's Detail
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Login to see detailsTender Details
The PIII technique consists of the accurate implementation of doping ions (such as boron, phosphorus or arsenic) in semiconductor materials. The NTC works specifically on the manufacture of photonic devices and for the moment it does not have this technique or any similar to carry out "doping" of the components that manufacture. It would be a new technique allowing improvements in the quality and characteristics of the manufactured photonic components. The main element of a photonic component is the wave guide that is usually made on silicon (or silicon nitruro) and this Technique, implementing ions of different materials within these guides, would allow modifying the refraction index of the silicon and improving its properties.
As an example of possible future application, the NTC would have the ability to implement materials such as erbium within wave guides In silicon to manufacture integrated optical amplifiers, which are essential in fiber optic communication systems to compensate for signal loss to long distances.
Since photonics often involves heat -sensitive materials, PIII's ability to operate at low temperatures It is a great advantage, since it avoids thermal damage to the devices.
In addition, the PIII technique is scalable and can be applied to large wafers, which makes it appropriate for mass production of photonic devices. The NTC would need a PIII team to process with wafers of day...
Document Type: Contract Notice
Reference Number: MY25/IUTNA/S/37
Contract Type: Supplies
Estimated Value: 590000 - EUR
Authority Type: Body-P-ra
Doc Title: Acquisition of an ion implantation equipment by plasma immersion (PIII)
Dispatch Date: 2025-07-22
Publish Date: 2025-07-23
Submission Date: 2025-08-06
Documents
Tender Notice