NATIONAL AERONAUTICS AND SPACE ADMINISTRATION has floated a tender for Technology Transfer Opportunity: Molten Target Sputtering (Mts) Deposition: Lar-18659-1. The project location is USA and the tender is closing on 22 May 2019. The tender notice number is TT01269, while the TOT Ref Number is 23742857. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.

Expired Tender

Procurement Summary

Country : USA

Summary : Technology Transfer Opportunity: Molten Target Sputtering (Mts) Deposition: Lar-18659-1

Deadline : 22 May 2019

Other Information

Notice Type : Tender

TOT Ref.No.: 23742857

Document Ref. No. : TT01269

Competition : ICB

Financier : Self Financed

Purchaser Ownership : -

Tender Value : Refer Document

Purchaser's Detail

Purchaser : NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Contracting Office Address: Nasa/Langley Research Center
Mail Stop 144
Industry Assistance Office
Hampton
Virginia 23681-0001

Primary Point of Contact: Jesse C Midgett,

Program Specialist
USA
Email :j.midgett@nasa.gov

Tender Details

Synopsis:



nasa langley research center in hampton, va solicits inquiries from companies interested in obtaining license rights to commercialize, manufacture and market the following technology. License rights may be issued on an exclusive or nonexclusive basis and may include specific fields of use. Nasa provides no funding in conjunction with these potential licenses.



The technology:



scientists at nasa langley research center have developed an enhanced sputtering process that addresses some of the weaknesses of conventional metal deposition sputtering. The conventional sputtering process has emerged as one of the major deposition techniques for thin film coating practices in research and industrial production. The process is limited by low deposition rates and low kinetic energy of the sputtered atoms. This not only slows the time required to sputter a film, it lowers the purity of the sputtered film. The molten target sputtering (mts) method can increase the kinetic energy, the energy latency, and the flux density of sputtered atoms by combining the benefits of both magnetron sputtering and evaporation systems. It does this by a clever, but simple mechanical modification to the magnetron sputtering gun. For the mts method, a simple 1~2mm (depth and width) ring-shaped groove is cut between the magnets in order to keep a gap between the copper plate and the sputtering target. This effectively is an efficiency increase to a current magnetron based sputtering machine. The ring enhances the magnetic field intensity and increases the temperature of the target material.





A key difference in design between a conventional sputtering gun and the mts gun seems very minor, but the ring-shaped groove between magnets allows for trapping a portion of magnetic field within the groove. A trapped field creates an additive force to expel the ionized particles (atoms and molecules combined within plasma) by increasing their kinetic energy. The ring groove also...

Documents

 Tender Notice