Procurement Summary
Country : USA
Summary : Technology Transfer Opportunity: Molten Target Sputtering (Mts) Deposition: Lar-18659-1
Deadline : 22 May 2019
Other Information
Notice Type : Tender
TOT Ref.No.: 23742857
Document Ref. No. : TT01269
Competition : ICB
Financier : Self Financed
Purchaser Ownership : -
Tender Value : Refer Document
Purchaser's Detail
Purchaser : NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Contracting Office Address: Nasa/Langley Research Center
Mail Stop 144
Industry Assistance Office
Hampton
Virginia 23681-0001
Primary Point of Contact: Jesse C Midgett,
Program Specialist
USA
Email :j.midgett@nasa.gov
Tender Details
Synopsis:
nasa langley research center in hampton, va solicits inquiries from companies interested in obtaining license rights to commercialize, manufacture and market the following technology. License rights may be issued on an exclusive or nonexclusive basis and may include specific fields of use. Nasa provides no funding in conjunction with these potential licenses.
The technology:
scientists at nasa langley research center have developed an enhanced sputtering process that addresses some of the weaknesses of conventional metal deposition sputtering. The conventional sputtering process has emerged as one of the major deposition techniques for thin film coating practices in research and industrial production. The process is limited by low deposition rates and low kinetic energy of the sputtered atoms. This not only slows the time required to sputter a film, it lowers the purity of the sputtered film. The molten target sputtering (mts) method can increase the kinetic energy, the energy latency, and the flux density of sputtered atoms by combining the benefits of both magnetron sputtering and evaporation systems. It does this by a clever, but simple mechanical modification to the magnetron sputtering gun. For the mts method, a simple 1~2mm (depth and width) ring-shaped groove is cut between the magnets in order to keep a gap between the copper plate and the sputtering target. This effectively is an efficiency increase to a current magnetron based sputtering machine. The ring enhances the magnetic field intensity and increases the temperature of the target material.
A key difference in design between a conventional sputtering gun and the mts gun seems very minor, but the ring-shaped groove between magnets allows for trapping a portion of magnetic field within the groove. A trapped field creates an additive force to expel the ionized particles (atoms and molecules combined within plasma) by increasing their kinetic energy. The ring groove also...
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