Login
Login
Register
Complete Your Profile
Change Password
Request a Password Reset
Download Documents
DEPT OF DEFENSE has floated a tender for Multiple Award Pcb Fab and Assembly Bpas. The project location is USA and the tender is closing on 04 Apr 2023. The tender notice number is HQ072723RRC01, while the TOT Ref Number is 80772373. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.
Procurement Summary
Country : USA
Summary : Multiple Award Pcb Fab and Assembly Bpas
Deadline : 04 Apr 2023
Other Information
Notice Type : Tender
TOT Ref.No.: 80772373
Document Ref. No. : HQ072723RRC01
Competition : ICB
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : Refer Document
Purchaser's Detail
Purchaser : DEPT OF DEFENSE
Contracting Office Address : MCCLELLAN, CA 956522100
Primary Point of Contact : Robert Crandell
robert.d.crandell.civ@mail.mil
Secondary Point of Contact : Ryan Tung
ryan.c.tung.civ@mail.mil
USA
Email :robert.d.crandell.civ@mail.mil
Tender Details
Description
(Correction on 23 March 2023 - to correct a 1 day error on the proposal due date)
DMEA-s mission includes developing electronics solutions that solve DoD obsolescence issues and/or provides state of the art SatCom solutions to DoD Programs. As such, there is a need to (1) rapidly produce developmental Printed Circuit Board Assemblies (PCBAs) for initial design and development use, (2) quickly produce prototype PCBAs for design validation, and (3) manufacture high quality PCBAs for use in DoD operational environments.
The purpose of this solicitation to is to competitively establish a pool of qualified BPA holders in order to rapidly obtain electronics products from industry and commercial PCB Fabrication and/or Assembly companies; specifically those produced by PCB Fabrication and PCB Assembly processes. Maximum ordering ceiling for each BPA holder is $1.2M over a 3 year period.
Additionally, the second phase of proposal and evaluation described in this solicitation serves as an RFQ for an actual order of PCBs, for which the Government anticipates multiple initial orders to be placed to have 500 units PCBs delivered.
Interested and capable PCB fabrication and/or PCB assembly vendors are highly encouraged to provide a proposal as instructed herein. Please see attached combined solicitation/synopsis, PWS for BPA scope, proposal instructions and evaluation criteria, and DRAFT BPA Agreement language.
Proposals are due to the Contracting Officer, Robert Crandell, via e-mail to robert.d.crandell.civ@mail.mil, no later than 2:00pm (Pacific), Tuesday, 4 April 2023.
Active Contract Opportunity
Notice ID : HQ072723RRC01
Related Notice
Department/Ind. Agency : DEPT OF DEFENSE
Sub-tier : DEFENSE MICROELECTRONICS ACTIVITY (DMEA)
Office : DEFENSE MICROELECTRONICS ACTIVITY
General Information
Contract Opportunity Type: Combined Synopsis/Solicitation (Updated)
All Dates/Times are: (UTC-07:00) PACIFIC STANDARD TIME, LOS ANGELES, USA
Updated Published Date: Mar 23, 2023 12:32 pm PDT
Original Published Date: Mar 21, 2023 09:51 am PDT
Updated Date Offers Due: Apr 04, 2023 02:00 pm PDT
Original Date Offers Due: Apr 03, 2023 02:00 pm PDT
Inactive Policy: 15 days after date offers due
Updated Inactive Date: Apr 19, 2023
Original Inactive Date: Apr 18, 2023
Initiative: None
Classification
Original Set Aside: Total Small Business Set-Aside (FAR 19.5)
Product Service Code: 5998 - ELECTRICAL AND ELECTRONIC ASSEMBLIES, BOARDS, CARDS, AND ASSOCIATED HARDWARE
NAICS Code: 334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing
Place of Performance: USA
Documents
Draft-BPA-Agreement--PWS-22-2D6--PCB-Fab-and-Assembly.pdf
Proposal-Instructions-and-Evaluation-Criteria--PWS-22-2D6.pdf
PWS-22-2D6--PCB-Fab-and-Assembly-BPA-Scope.pdf
Combined-Synopsis-and-Solicitation--PWS-22-2D6--PCB-Fab-and-Assembly-BPA.pdf
Want To Bid in This Tender?
Get Local Agent Support in USA and 60 More Countries.
View Tenders By
Sign in with Google